# Powerchip to build new 12-inch wafer fab in Taiwan

Powerchip Technology plans to build a new 12-inch wafer plant in the Tongluo campus of Hsinchu Science Park in Miaoli, Taiwan, with total investment estimated at nearly NT$300 billion (US$10.1 billion).

- Type: New facility
- Announced: 2018-05-11
- Where: Tongluo, Miaoli, Taiwan, TWN
- Value: $10.1B (300.0B TWD)
- Status: announced
- Products: 12-inch wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Powerchip Technology](https://endata.com/companies/19704.md)

## Sources

- [apps.digitimes.com](https://apps.digitimes.com/news/a20180511PD212.html), 2018-05-11: "Foundry chipmaker Powerchip Technology plans to build a new 12-inch wafer plant in the Tongluo campus of Hsinchu Science Park (HSP) in Miaoli, northern Taiwan with total investment estimated at nearly NT$300 billion (US$10.1 billion)."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.