# Samsung breaks ground on second memory chip plant in Xi'an, China

Samsung (China) Semiconductor Co., Ltd. held a groundbreaking ceremony for its second-phase memory chip project in Xi'an, Shaanxi province, on March 28, 2018. The expansion follows a 2017 investment agreement with the Shaanxi provincial government to meet growing demand for high-end V-NAND products.

- Type: Expansion
- Announced: 2018-03-28
- Where: Xi'an, Shaanxi, China
- Value: $7.00B
- Starts operating: 2020
- Status: under construction
- Capacity: 220,000 300mm wafers per month
- Products: V-NAND memory chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)
- [Samsung (China) Semiconductor](https://endata.com/companies/19018.md)

## Sources

- [chinanews.com.cn](https://www.chinanews.com.cn/m/business/2018/03-28/8478142.shtml), 2018-03-28: "将会通过二期的成功运营生产最尖端的存储芯片，为客户提供独具匠心的解决方案"
- [telecompaper.com](https://www.telecompaper.com/news/samsung-starts-building-second-chip-production-line-at-xian-factory--1237895), 2018-03-28: "Samsung Electronics reports it has started building a second production line at its factory in Xian, China, to meet the increasing demand for its 3D V-NAND products."
- [aldfinancials.blogspot.com](http://aldfinancials.blogspot.com/2018/04/samsung-electronics-to-double-3dnand.html), 2018-04-07: "Samsung Electronics said Wednesday that it will invest $7 billion over three years to double production capacity for NAND flash memory in China."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.