# Panasonic to start MUF material production in Shanghai

Panasonic announced that Panasonic Industrial Devices Materials (Shanghai) Co., Ltd. will start high-volume manufacturing of molded underfill semiconductor encapsulation materials in March 2018 to meet growing demand in China.

- Type: Expansion
- Announced: 2018-02-07
- Where: Shanghai, China
- Starts operating: Mar 2018
- Status: announced
- Products: molded underfill semiconductor encapsulation materials
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Panasonic](https://endata.com/companies/1026.md)

## Sources

- [news.panasonic.com](https://news.panasonic.com/global/press/en180208-2), 2018-02-07: "Panasonic will launch the mass production of molded underfill semiconductor encapsulation materials in Shanghai, China in response to the increased production of leading-edge semiconductor packages in the region."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.