# USI subsidiary and Qualcomm Technologies to form SiP module joint venture in Brazil

Universal Global Electronics Co., Limited (USI subsidiary) and Qualcomm Technologies signed a joint venture agreement on February 6, 2018, to establish a company in São Paulo, Brazil, to develop and manufacture system-in-package (SiP) modules for smartphones and IoT. USI will invest $70.5 million (75%) and Qualcomm $23.5 million (25%), with total funding of $94 million.

- Type: Acquisition
- Announced: 2018-02-06
- Where: São Paulo state, Brazil
- Value: $94.0M
- Status: announced
- Products: system-in-package (SiP) modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Qualcomm Technologies](https://endata.com/companies/23202.md) (partner)
- [Universal Scientific Industrial (Shanghai)](https://endata.com/companies/29912.md) (partner)

## Sources

- [paper.cnstock.com](https://paper.cnstock.com/html/2018-02/07/content_948937.htm), 2018-02-07: "环旭电子之全资子公司环海电子与高通公司之全资子公司Qualcomm Technologies于北京时间2018年02月06日于巴西圣保罗签署合资协议，拟在巴西投资新设合资公司。"

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.