# Qualcomm and USI form joint venture for SiP modules in Brazil

Qualcomm and Universal Scientific Industrial signed an agreement to form a joint venture in Brazil to design and manufacture system-in-package modules for smartphones and IoT devices, expected to start production in 2020.

- Type: Partnership
- Announced: 2018-02-06
- Where: Sao Paulo, Brazil
- Status: announced
- Products: system-in-package modules, RF and digital components for smartphones and IoT devices
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Qualcomm](https://endata.com/companies/16058.md) (partner)
- [Universal Scientific Industrial](https://endata.com/companies/29847.md) (partner)

## Sources

- [circuitsassembly.com](https://circuitsassembly.com/ca/editorial/menu-news/28840-qualcomm-usi-set-up-jv-to-build-sip-modules-in-brazil.html), 2018-02-06: "The JV will produce system-in-package modules powered by Qualcomm chipsets and the modules include, in a single component, the RF and digital components for smartphones and IoT devices."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.