# Sirect Semiconductor and Lingsun Electronics to form joint venture for power semiconductors

Sirect Semiconductor and Dongguan Lingsun Electronics signed a memorandum of understanding to form a joint venture company (51% and 49% shareholding) specializing in third-generation wide bandgap power semiconductors, power factor correction, and bridge rectifiers. The JV plans to produce 600 million power devices annually within five years.

- Type: Acquisition
- Announced: 2018-01-08
- Where: China
- Status: announced
- Capacity: 600 million power devices annually
- Products: third-generation wide bandgap power semiconductors, power factor correction modules, tandem bridge rectifiers, MOSFETs
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Sirect Semiconductor](https://endata.com/companies/29233.md) (partner)
- [Dongguan Lingsun Electronics](https://endata.com/companies/29234.md) (partner)

## Sources

- [m.sirect.com](http://m.sirect.com/m/news_view.aspx?Fid=t2%3A4%3A2&Id=225&TypeId=4&typefid=4), 2018-01-08: "A memorandum of understanding has been signed, which will be sent to the boards of directors of both sides for approval."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.