# Silan and Xiamen Semiconductor to build compound semiconductor line in Xiamen

Silan Microelectronics and Xiamen Semiconductor Investment Group will jointly invest CNY5 billion (USD756 million) to build a 4/6-inch compatible advanced compound semiconductor device production line in Haicang district, Xiamen, China. Products include optical communication module chips, 5G and RF modules, and high-end LED chips.

- Type: Investment
- Announced: 2017-12-18
- Where: Haicang district, Xiamen, Fujian, China
- Value: $756.0M (5.00B CNY)
- Status: announced
- Products: optical communication module chips, 5G and RF modules, high-end LED chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hangzhou Silan Microelectronics](https://endata.com/companies/28899.md)
- [Xiamen Semiconductor Investment Group](https://endata.com/companies/28895.md) (partner)

## Sources

- [www2.yicaiglobal.com](https://www2.yicaiglobal.com/news/silan-local-chinese-government-will-jointly-invest-usd26-billion-in-se-china-integrated-circuit-project), 2017-12-19: "The company will also jointly invest CNY5 billion (USD756 million) together with Xiamen Semiconductor Investment Group Co. to build a 4/6-inch compatible advanced compound semiconductor device production line in Haicang district."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.