# Silan Microelectronics to build semiconductor fabs in Xiamen

Silan Microelectronics and Xiamen Semiconductor Investment Group will invest a total of CNY 22 billion to build two 12-inch wafer fabs and one advanced compound semiconductor line in Xiamen's Haicang district. The 12-inch fab project is valued at CNY 17 billion and the compound semiconductor project at CNY 5 billion.

- Type: Investment
- Announced: 2017-12-18
- Where: Xiamen, Haicang district, China, China
- Value: $3.30B (22.0B CNY)
- Status: announced
- Capacity: 8,000 wafers per month for the first 12-inch line (initial 4,000 wafers per month)
- Products: MEMS, power devices, compound semiconductors, optical communication chips, 5G/RF modules, high-end LED chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Silan Microelectronics](https://endata.com/companies/28894.md)
- [Xiamen Semiconductor Investment Group](https://endata.com/companies/28895.md) (partner)

## Sources

- [esmchina.com](https://www.esmchina.com/news/201712191545.html), 2017-12-19: "士兰微电子与厦门半导体投资集团有限公司拟共同总投资220亿元，在厦门海沧区建设两条12吋特色工艺晶圆生产线和一条先进化合物半导体生产线。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.