# Soilbuild and RF360 invest over S$600M in Kallang Way facility

Soilbuild Group is constructing a building at Kallang Way, Singapore, to house RF360, a joint venture between Qualcomm and TDK. RF360 is committing S$500 million and Soilbuild over S$110 million. The facility is expected to be completed in June 2019 and will create 300 new jobs.

- Type: New facility
- Announced: 2017-11-29
- Where: Kallang Way, Singapore, Singapore
- Value: $450.0M (610.0M SGD)
- Jobs: 300
- Starts operating: Jun 2019
- Status: under construction
- Products: radio frequency modules and filters, surface acoustic wave structured wafers, thin film acoustic packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Soilbuild Group](https://endata.com/companies/28453.md)
- [TDK Corporation](https://endata.com/companies/15441.md) (investor)
- [Qualcomm](https://endata.com/companies/16058.md) (investor)
- [RF360 Holdings](https://endata.com/companies/21950.md) (customer)

## Sources

- [straitstimes.com](https://www.straitstimes.com/business/property/soilbuild-german-tech-firm-rf360-invest-over-s600m-to-build-kallang-way-facility), 2017-11-29: "RF360 said that it is expanding to capture the strong demand growth in the radio frequency application market, and is committing S$500 million to the custom-built site."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.