# IM Flash opens new fabrication wing in Lehi, Utah

IM Flash, a joint venture between Micron Technology and Intel, opened Building 60, a new fabrication wing in Lehi, Utah, for manufacturing 3D XPoint memory products. The facility will produce 3D XPoint, a non-volatile memory technology.

- Type: Expansion
- Announced: 2017-11-14
- Where: Lehi, Utah, United States
- Starts operating: 14 Nov 2017
- Status: completed
- Products: 3D XPoint memory, microchips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [IM Flash](https://endata.com/companies/28102.md)
- [Micron Technology](https://endata.com/companies/16026.md) (partner)
- [Intel](https://endata.com/companies/21062.md) (partner)

## Sources

- [heraldextra.com](https://www.heraldextra.com/news/2017/nov/14/im-flash-opens-new-fab-facility-in-lehi/), 2017-11-14: "We generally don't let anybody in our clean rooms, but you guys are special."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.