# Tacoma Technology partners with Tower Semiconductor to build chip fabs in Nanjing

Hong Kong-based Tacoma Technology Ltd. partnered with Israeli chipmaker Tower Semiconductor Ltd. to build chip fabrication plants in Nanjing, China, as part of a $3 billion chip manufacturing and design industry park project with the Nanjing Development Zone.

- Type: Partnership
- Announced: 2017-08-23
- Where: Nanjing, China, China
- Value: $3.00B
- Status: announced
- Products: chip fabrication plants
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tower Semiconductor](https://endata.com/companies/16113.md) (partner)
- [Tacoma Technology](https://endata.com/companies/22290.md) (partner)

## Sources

- [calcalistech.com](https://www.calcalistech.com/ctech/articles/0,7340,L-3719737,00.html), 2017-08-23: "Hong Kong-registered holding company Tacoma Technology Ltd. partnered with Israel-based chipmaker Tower Semiconductor Ltd. in building chip fabrication plants in Nanjing, China."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.