# Qualcomm and TDK form RF360 joint venture for RF front-end modules

Qualcomm and TDK announced a joint venture, RF360 Holdings, to develop fully integrated RF front-end modules and filters. Qualcomm will hold 51% and TDK 49%, with a total estimated transaction value of USD 3 billion.

- Type: Acquisition
- Announced: 2017-07-03
- Where: Singapore, Singapore
- Value: $3.00B
- Status: announced
- Products: RF front-end modules, RF filters (SAW, TC-SAW, BAW)
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [TDK Corporation](https://endata.com/companies/15441.md) (partner)
- [Qualcomm](https://endata.com/companies/16058.md) (partner)
- [RF360 Holdings](https://endata.com/companies/21950.md) (target)

## Sources

- [developer.aliyun.com](https://developer.aliyun.com/article/140003), 2017-07-03: "透过与RF360 控股公司携手，该公司将获得全方位的产品设计能力，从数据机/收发器到天线，建构出高度整合的系统。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.