# Tongfu Microelectronics to build advanced IC packaging line in Xiamen

Tongfu Microelectronics signed a strategic cooperation agreement with the Haicang District government to jointly build an advanced integrated circuit packaging and testing production line in Xiamen, with a total investment of 7 billion yuan.

- Type: New facility
- Announced: 2017-06-26
- Where: Haicang District, Xiamen, China, China
- Value: $1.03B (7.00B CNY)
- Status: announced
- Products: advanced integrated circuit packaging and testing
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/22832.md)

## Sources

- [en.tfme.com](https://en.tfme.com/news/315.html), 2017-06-26: "The total investment for the Project will be 7 billion yuan, with plans to establish an industrialized base focusing on cutting-edge packaging and testing technologies."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.