# HLMC and Cypress launch 55nm embedded flash production

HLMC and Cypress Semiconductor announced production of low-power embedded flash products using HLMC's 55nm LP process with Cypress's SONOS IP, with full production expected in H2 2017.

- Type: Product launch
- Announced: 2017-03-31
- Where: China
- Status: announced
- Products: embedded flash memory, 55nm low-power process technology
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shanghai Huali Microelectronics](https://endata.com/companies/21163.md)
- [Cypress Semiconductor](https://endata.com/companies/22566.md) (partner)

## Sources

- [digitimes.com](https://www.digitimes.com/news/a20170330PR201.html?chid=9), 2017-03-31: "This embedded flash product has already entered risk production in 2016."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.