# Tongfu Microelectronics partners with Infineon to build smart factory

Tongfu Microelectronics signed a strategic cooperation agreement with Infineon to build a smart factory. The gold bump packaging and testing project received support from the National Project 02.

- Type: Partnership
- Announced: 2017-03-15
- Where: Nantong, Jiangsu, China
- Status: announced
- Capacity: 12 million units per day by year-end
- Products: gold bump packaging and testing
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/22832.md)
- [Infineon](https://endata.com/companies/22833.md) (partner)

## Sources

- [en.tfme.com](https://en.tfme.com/news/1025.html), 2017-03-15: "Signed a strategic cooperation agreement with Infineon to build a smart factory."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.