# Shinryo plans to expand 300mm wafer plating capacity in fiscal 2026

Shinryo, part of Mitsubishi Chemical Group, plans to expand its 300mm wafer plating production capacity in winter of fiscal 2026 and install automated bump inspection equipment to meet growing demand for prototype and mass-production wafer bump plating services.

- Type: Expansion
- Announced: 2017-02-28
- Where: Kitakyushu, Japan
- Starts operating: Q4 2026
- Status: announced
- Products: wafer bump plating, solder bumps
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shinryo](https://endata.com/companies/22508.md)

## Sources

- [denshi.shinryo-gr.com](https://www.denshi.shinryo-gr.com/eng.), 2017-02-28: "In fiscal 2026, Shinryo plans to expand φ300mm wafer plating production capacity in winter, and install automated bump appearance inspection apparatus, to respond to increasing prototype/mass-production demands."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.