# GE Ventures and Samsung Electro-Mechanics sign microelectronics packaging patent license agreement

GE Ventures and Samsung Electro-Mechanics announced a multi-year, worldwide patent license agreement for GE's microelectronics packaging patent portfolio, covering fabrication of substrates embedded with electronic circuits.

- Type: Contract
- Announced: 2017-02-16
- Where: Niskayuna, NY, United States
- Status: announced
- Products: microelectronics packaging, embedded electronic circuit substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electro-Mechanics](https://endata.com/companies/15109.md) (partner)
- [GE Ventures](https://endata.com/companies/22237.md) (partner)

## Sources

- [ge.com](https://www.ge.com/news/press-releases/ge-ventures-and-samsung-electro-mechanics-announce-global-microelectronics-packaging), 2017-02-16: "GE is extremely pleased that SEMCO has recognized the significance of GE's IP in this space."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.