# Amkor Technology to acquire NANIUM for wafer-level packaging

Amkor Technology entered into a definitive agreement to acquire NANIUM S.A., a provider of wafer-level fan-out semiconductor packaging solutions based in Porto, Portugal. The transaction was announced on February 2, 2017, with terms not disclosed.

- Type: Acquisition
- Announced: 2017-02-02
- Where: Vila do Conde, Porto, Portugal, Portugal
- Status: announced
- Products: wafer-level fan-out packaging, semiconductor packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Amkor Technology](https://endata.com/companies/21914.md) (acquirer)
- [NANIUM](https://endata.com/companies/21915.md) (target)

## Sources

- [ir.amkor.com](https://ir.amkor.com/news-releases/news-release-details/amkor-technology-acquire-nanium), 2017-02-02: "This strategic acquisition will enhance Amkor's position as one of the leading providers of WLP and WLFO packaging solutions."
- [sec.gov](https://www.sec.gov/Archives/edgar/data/1047127/000104712717000002/naniumannouncementfeb2017.htm), 2017-02-03: "On February 2, 2017, Amkor and NANIUM S.A. issued a press release announcing that they have entered into a definitive agreement for Amkor to acquire NANIUM."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.