# Shanghai Huali Microelectronics breaks ground on $5.6B wafer plant

Shanghai Huali Microelectronics Co. broke ground on a 38.7 billion yuan ($5.6 billion) wafer plant in Kangqiao, Pudong New Area, Shanghai on December 30, 2016, to manufacture advanced chips for smartphones, with production starting in 2018 and full capacity of 40,000 units monthly by 2022.

- Type: New facility
- Announced: 2017-01-03
- Where: Kangqiao, Pudong New Area, Shanghai, China
- Value: $5.60B (38.7B CNY)
- Starts operating: 2018
- Status: under construction
- Capacity: 40,000 units monthly at full capacity
- Products: advanced chips, wafer
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shanghai Huali Microelectronics](https://endata.com/companies/21163.md)
- [Huahong Group](https://endata.com/companies/21164.md) (partner)

## Sources

- [en.imsilkroad.com](https://en.imsilkroad.com/p/62881.html), 2017-01-03: "Huali’s wafer plant, located in Kangqiao in the Pudong New Area, will manufacture chips adopting the most advanced technology on the Chinese mainland"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.