# ChipMOS and Tsinghua Unigroup agree to form joint venture

ChipMOS Technologies and Tsinghua Unigroup announced an agreement to form a joint venture and mutually terminate Tsinghua Unigroup's earlier investment.

- Type: Acquisition
- Announced: 2016-12-06
- Status: announced
- Products: semiconductor packaging and testing services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [ChipMOS Technologies](https://endata.com/companies/19493.md) (partner)
- [Tsinghua Unigroup](https://endata.com/companies/19494.md) (partner)

## Sources

- [semiconductorpackagingnews.com](https://www.semiconductorpackagingnews.com/press/57845.html), 2016-12-06: "ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier ..."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.