# Samsung Electronics to build HBM packaging fab in Onyang, South Korea

Samsung Electronics will hold a groundbreaking ceremony for a new HBM advanced packaging fab at its Onyang site in Asan, South Korea, investing approximately 1.3 trillion won. The facility will have a 31,000 sqm cleanroom and target mass production by May 2029.

- Type: New facility
- Announced: 2026-11-05
- Where: Onyang, Asan, South Chungcheong Province, South Korea, South Korea
- Value: $975.0M (1300.0B KRW)
- Starts operating: May 2029
- Status: announced
- Products: HBM (High Bandwidth Memory) advanced packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)

## Sources

- [mt.co.kr](https://www.mt.co.kr/en/industry/2026/11/05/2026110511172390495), 2026-11-05: "This marks a semiconductor speed-up campaign aimed at dispelling the AI bubble theory raised by some quarters."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.