# Samsung Electronics plans $18.7B advanced foundry fab in Giheung

Samsung Electronics is preparing brownfield land at its Giheung campus for an estimated $18.7 billion advanced foundry fab to manufacture 2nm and 4nm logic chips. Initial construction work has begun under a framework contract with Samsung E&A, with structural handover scheduled for December 31, 2028.

- Type: New facility
- Announced: 2026-11-04
- Where: Giheung, South Korea, South Korea
- Value: $18.7B
- Status: under construction
- Products: 2nm logic chips, 4nm logic chips, HBM base dies
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)
- [Samsung E&A](https://endata.com/companies/12473.md) (partner)

## Sources

- [eastasiabrief.com](https://eastasiabrief.com/semiconductors/samsung-electronics-plans-18-7b-giheung-fab-expand-2nm-1133), 2026-11-05: "Samsung Electronics moved Nov. 4 to expand its contract chipmaking footprint, preparing brownfield land at its Giheung campus for an estimated $18.7 billion advanced foundry project."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.