# Samsung Electronics breaks ground on HBM packaging line in Asan, South Korea

Samsung Electronics held a groundbreaking ceremony for a new HBM packaging production line (Line 5) at its Onyang campus in Asan, South Chungcheong Province. The facility, part of a 144 trillion won investment by Samsung and affiliates, is scheduled to begin operations in June 2028.

- Type: New facility
- Announced: 2026-11-12
- Where: Asan, South Chungcheong Province, South Korea
- Value: $45.1B (60000.0B KRW)
- Jobs: 700
- Starts operating: Jun 2028
- Status: under construction
- Capacity: 31,000 m² cleanroom
- Products: HBM (high bandwidth memory) packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)

## Sources

- [businesspost.co.kr](https://www.businesspost.co.kr/BP?command=article_view&num=451834), 2026-11-12: "일반 반도체를 단순 조립·검사하는 공정이 중심이었던 이곳이 앞으로는 인공지능(AI) 반도체의 심장인 최첨단 HBM 거점으로 변모할 것"
- [koreatimes.co.kr](https://www.koreatimes.co.kr/business/companies/20261112/samsung-electronics-breaks-ground-on-new-hbm-packaging-facility-in-asan), 2026-11-12: "Samsung Electronics broke ground on a new semiconductor packaging facility at its Onyang campus in Asan"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.