# Samsung Electronics to invest $4.48B in HBM chip packaging plant in Asan, South Korea

Samsung Electronics is investing 6 trillion won ($4.48 billion) in a high-bandwidth memory (HBM) chip packaging plant in Asan, South Korea. The new HBM production line is scheduled to begin operations in June 2028, a year earlier than initially planned.

- Type: Expansion
- Announced: 2026-11-12
- Where: Asan, South Korea, South Korea
- Value: $4.48B
- Starts operating: Jun 2028
- Status: under construction
- Capacity: 31,000 square metres of clean-room space
- Products: high-bandwidth memory (HBM) chip packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)

## Sources

- [channelnewsasia.com](https://www.channelnewsasia.com/business/south-koreas-lee-says-samsung-chip-packaging-expansion-spur-30-billion-additional-investment-6544456), 2026-11-12: "The new HBM production line is scheduled to begin operations in June 2028, a year earlier than initially planned."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.