# Samsung chip packaging expansion to spur $30B additional investment

South Korean President Lee Jae Myung stated that Samsung Electronics' 6 trillion won ($4.48 billion) investment in an HBM chip packaging plant in Asan will be followed by about 40 trillion won ($30 billion) in advanced equipment investment.

- Type: Investment
- Announced: 2026-11-12
- Where: Asan, South Korea, South Korea
- Value: $30.0B (40000.0B KRW)
- Status: announced
- Products: high-bandwidth memory (HBM) chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)

## Sources

- [investing.com](https://www.investing.com/news/stock-market-news/south-koreas-lee-says-samsung-chip-packaging-expansion-to-spur-30-billion-additional-investment-5020166), 2026-11-12: "Samsung Electronics’ 6 trillion won investment in a high-bandwidth memory chip packaging plant in Asan would be followed by about 40 trillion won in investment in advanced equipment."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.