# Unisem plans RM400m private placement for expansion in Malaysia and China

Unisem (M) Bhd proposed a private placement to raise up to RM399.9 million to fund expansion of its semiconductor assembly and test facility in Ipoh, Malaysia, and construction of a new production facility in Chengdu, China.

- Type: Expansion
- Announced: 2026-11-10
- Where: Ipoh, Malaysia
- Value: $96.0M (399.9M MYR)
- Status: announced
- Products: semiconductor assembly and test services, wafer bumping
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Unisem (M) Bhd](https://endata.com/companies/16241.md)

## Sources

- [theedgemalaysia.com](https://theedgemalaysia.com/article/unisem-plans-rm400m-private-placement-expansion-malaysia-china), 2026-11-10: "The group has plans to improve the production capacity of its semiconductor assembly and test facility and the wafer bumping facility in Ipoh."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.