# Powertech Technology and Broadcom plan $400M packaging JV in Singapore

Powertech Technology and Broadcom intend to establish a $400 million advanced-packaging joint venture in Singapore, with production potentially beginning in 2028.

- Type: Investment
- Announced: 2026-11-06
- Where: Singapore, Singapore
- Value: $400.0M
- Starts operating: 2028
- Status: announced
- Products: advanced semiconductor packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Broadcom](https://endata.com/companies/19514.md) (partner)
- [Powertech Technology](https://endata.com/companies/34511.md) (partner)

## Sources

- [ganjingworld.com](https://www.ganjingworld.com/article/1ivj3hbhhqp2QurSWE3VYa6LR1ch1c), 2026-11-06: "The company is collaborating with AMD and Broadcom and intends to establish a $400 million advanced-packaging joint venture with Broadcom in Singapore."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.