# Paras Semiconductors and BroadPak partner for advanced semiconductor packaging in India

Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, announced a strategic technology partnership with BroadPak Corporation to accelerate advanced semiconductor packaging capabilities in India. The partnership aims to establish an advanced heterogeneous integration and 3D packaging OSAT facility in India.

- Type: Partnership
- Announced: 2026-11-06
- Where: India
- Status: announced
- Products: advanced semiconductor packaging, opto-electronics, photonics, co-packaged optics
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Paras Semiconductors](https://endata.com/companies/94970.md)
- [Paras Defence and Space Technologies](https://endata.com/companies/93902.md) (partner)
- [BroadPak Corporation](https://endata.com/companies/94971.md) (partner)

## Sources

- [economictimes.indiatimes.com](https://economictimes.indiatimes.com/tech/technology/paras-semiconductors-broadpak-join-hands-to-build-advanced-semiconductor-packaging-capabilities/articleshow/135613172.cms), 2026-11-06: "Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies Limited, announced a strategic technology partnership with BroadPak Corporation, USA, to accelerate the development of advanced semiconductor packaging capabilities in India"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.