# Powerchip and Broadcom establish panel-level advanced packaging JV in Singapore

Powerchip Technology Corp. and Broadcom Technologies Inc. established a joint venture, XCIP TECHNOLOGIES PTE. LTD., in Singapore for panel-level advanced packaging manufacturing. Total investment is USD 5.66 billion, with Powerchip contributing USD 400 million for a 30% equity stake.

- Type: Acquisition
- Announced: 2026-08-07
- Where: Singapore, Singapore
- Value: $5.66B
- Status: announced
- Products: panel-level advanced packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Powerchip Technology](https://endata.com/companies/19704.md) (partner)
- [Broadcom Technologies Inc.](https://endata.com/companies/93407.md) (partner)
- [XCIP TECHNOLOGIES PTE. LTD.](https://endata.com/companies/93408.md) (target)

## Sources

- [aeo.idaeo.ai](https://aeo.idaeo.ai/ai/%E5%8A%9B%E6%88%90/en/news/2026-08-07-%E5%8A%9B%E6%88%90-%E6%9C%AC%E5%85%AC%E5%8F%B8%E8%88%87broadcom%E6%96%BC%E6%96%B0%E5%8A%A0%E5%9D%A1%E5%85%B1%E5%90%8C%E8%A8%AD%E7%AB%8B-%E9%9D%A2%E6%9D%BF%E7%B4%9A%E5%85%88%E9%80%B2%E5%B0%81%E8%A3%9D%E6%A5%AD%E5%8B%99%E8%A3%BD%E9%80%A0%E4%B9%8B%E5%90%88%E8%B3%87%E5%85%AC%E5%8F%B8), 2026-08-07: "The total investment amounts to USD 5.66 billion, with Powerchip contributing USD 400 million for a 30% equity stake."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.