# Samsung Electronics to expand HBM plant in Asan, South Korea

Samsung Electronics signed an MOU with Asan city to expand its HBM production facility at the Onyang campus. The expansion adds 31,000 m² of cleanroom space, with construction starting in October 2026 and mass production targeted for May 2029.

- Type: Expansion
- Announced: 2026-07-22
- Where: Asan, South Korea, South Korea
- Value: $180.0M (240.0B KRW)
- Jobs: 700
- Starts operating: May 2029
- Status: announced
- Capacity: 31,000 m² cleanroom
- Products: HBM (high-bandwidth memory)
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)
- [Flext Group](https://endata.com/companies/93625.md) (partner)

## Sources

- [cctimes.kr](http://www.cctimes.kr/news/articleView.html?idxno=917879), 2026-07-22: "아산은 삼성전자 반도체 패키지 사업의 핵심 거점이자 AI 시대 글로벌 반도체 경쟁력을 이끌 HBM 생산기지의 출발점"
- [mk.co.kr](https://www.mk.co.kr/jp/business/12130792), 2026-08-19: "Samsung Electronics is building a new HVAC production line at its Gwangju campus to produce core HVAC products such as coolant distribution units, with operations starting in early 2028."
- [en.sedaily.com](https://en.sedaily.com/society/2026/08/19/samsung-chip-plant-in-chungnam-to-break-ground-in-september), 2026-08-19: "The expansion will invest 6 trillion won ($4.4 billion) to build a new plant on a 389,825-square-meter site within the Onyang campus, aimed at boosting production of high-performance AI chips such as high-bandwidth memory (HBM)."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.