# Tower Semiconductor announces strategic capacity expansion in Japan

Tower Semiconductor announced a dual-track expansion of its 300mm Silicon Photonics, Silicon Germanium, and advanced packaging capabilities in Japan, with support from the Government of Japan. Track one repurposes the Arai facility for 300mm SiPho capacity with production readiness expected in Q4 2027.

- Type: Expansion
- Announced: 2026-07-14
- Where: Arai and Uozu, Japan, Japan
- Starts operating: Q4 2027
- Status: announced
- Products: Silicon Photonics, Silicon Germanium, advanced packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tower Semiconductor](https://endata.com/companies/16113.md)

## Sources

- [ir.towersemi.com](https://ir.towersemi.com/news-releases/news-release-details/tower-semiconductor-meti-support-announces-strategic-capacity/), 2026-07-14: "Together, we are building a globally differentiated center of excellence founded on technology leadership, manufacturing excellence, and exceptional product quality."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.