# Forehope Electronic plans CNY 10.3B high-end chip packaging plant in Yuyao

Forehope Electronic announced plans to invest CNY 10.3 billion (USD 1.5 billion) in the third phase of its project at the Sino-Italy Ningbo Ecological Park in Yuyao, China. The plant will use advanced packaging technologies including BUMP, 2.5D, FC, and WB, with construction over 96 months.

- Type: New facility
- Announced: 2026-06-26
- Where: Yuyao, Ningbo, Zhejiang, China
- Value: $1.50B (10.3B CNY)
- Status: announced
- Products: high-end chip packaging, advanced packaging services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Forehope Electronic](https://endata.com/companies/92697.md)

## Sources

- [yicaiglobal.com](https://www.yicaiglobal.com/news/chinas-forehope-electronic-pops-after-unveiling-plan-to-build-new-high-end-chip-packaging-plant-for-usd15-billion), 2026-06-29: "The expansion is focused on cutting-edge packaging processes that are among the most advanced in the industry."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.