# DIC to invest ¥9B to expand semiconductor epoxy resin capacity at Chiba Factory

DIC Corporation will invest 9 billion yen (approx. 405 million RMB) to build a new semiconductor epoxy resin production line at its Chiba Factory. Construction starts in 2026, with production launch scheduled for July 2029, increasing overall capacity by 59%.

- Type: Expansion
- Announced: 2026-06-25
- Where: Chiba Factory, Japan
- Value: $60.0M (9.00B JPY)
- Starts operating: Jul 2029
- Status: announced
- Capacity: 59% increase in semiconductor epoxy resin capacity
- Products: semiconductor epoxy resin
- Sectors: [Specialty Chemicals](https://endata.com/sectors/specialty-chemicals.md), [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [DIC Corporation](https://endata.com/companies/19672.md)

## Sources

- [news.chemnet.com](https://news.chemnet.com/news-6750.html), 2026-06-25: "The total investment for this project is 9 billion yen, approximately 405 million RMB, with the core construction being a brand-new semiconductor epoxy resin production line."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.