# JCET to build $1.15B advanced chip packaging plant in Shanghai

JCET will invest 7.8 billion yuan ($1.15 billion) to build an advanced packaging and testing factory in Shanghai's Lin-gang Special Area. The project will be rolled out in two phases, with the first phase scheduled for completion in the second half of 2028.

- Type: New facility
- Announced: 2026-06-25
- Where: Lin-gang Special Area, Shanghai, China
- Value: $1.15B (7.80B CNY)
- Starts operating: Q3 2028
- Status: announced
- Products: advanced chip packaging and testing
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [JCET](https://endata.com/companies/16865.md)

## Sources

- [scmp.com](https://www.scmp.com/tech/article/3358264/chinas-jcet-build-new-plant-shanghai-expand-advanced-chip-packaging), 2026-06-25: "Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics Technology (JCET) says it will invest 7.8 billion yuan (US$1.15 billion) to build a new plant."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.