# UNT plans CNY 20B Phase IV wafer fab in Shaoxing for automotive mixed-signal chips

United Nova Technology (UNT) announced plans to invest approximately CNY 20 billion in a Phase IV 12-inch automotive-grade mixed-signal semiconductor manufacturing facility in Shaoxing, with UNT contributing CNY 3.012 billion. The facility will have a monthly capacity of 50,000 wafers, focusing on 40nm-28nm MCU/DSP and 90nm-55nm analog devices, including silicon photonics chips.

- Type: Investment
- Announced: 2026-06-11
- Where: Shaoxing, Zhejiang, China
- Value: $2.80B (20.0B CNY)
- Status: announced
- Capacity: 50,000 12-inch wafers per month
- Products: automotive mixed-signal chips, MCU, DSP, BCD, DrMOS, silicon photonics chips, laser driver ICs
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [United Nova Technology](https://endata.com/companies/92442.md)

## Sources

- [trendforce.com](https://www.trendforce.com/news/2026/06/24/news-unt-unveiled-plans-to-expand-wafer-production-with-cny-3b-partly-for-optical-interconnect-applications/), 2026-06-24: "The investment will help the company capitalize on emerging opportunities in AI servers and optical interconnect applications."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.