# Hanmi Semiconductor wins $29M TC bonder supply deal from SK hynix

Hanmi Semiconductor won a 44.2 billion won ($29 million) order from SK hynix to supply TC Bonder 4.5 Griffin equipment for HBM4 production. The contract is scheduled for completion by September 2.

- Type: Contract
- Announced: 2026-06-08
- Where: South Korea
- Value: $29.0M (44.2B KRW)
- Status: completed
- Products: TC Bonder 4.5 Griffin equipment
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hanmi Semiconductor](https://endata.com/companies/22183.md)
- [SK Hynix](https://endata.com/companies/2769.md) (customer)

## Sources

- [pulse.mk.co.kr](https://pulse.mk.co.kr/news/english/12069154), 2026-06-09: "Hanmi Semiconductor Co. has won a 44.2 billion won ($29 million) order from SK hynix Inc. to supply equipment for sixth-generation high-bandwidth memory (HBM4)."
- [mojotrick.com](https://www.mojotrick.com/2026/06/09/hanmi-secures-32-million-hbm4-equipment-order-from-sk-hynix/), 2026-06-09: "Hanmi Semiconductor has received a new order from SK Hynix to supply equipment used in making next-generation High Bandwidth Memory (HBM4) chips"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.