# Foxconn, Radiall and Thales launch Tessalia joint venture for semiconductor assembly in Le Barp

Foxconn, Radiall and Thales laid the foundation stone for Tessalia Technology SAS, a joint venture in Le Barp, France, dedicated to Outsourced Semiconductor Assembly and Testing (OSAT). The facility aims to produce more than 50 million System in Package (SiP) components per year by 2033.

- Type: New facility
- Announced: 2026-06-01
- Where: Le Barp, Nouvelle-Aquitaine, France
- Starts operating: 2033
- Status: under construction
- Capacity: 50 million System in Package (SiP) components per year
- Products: System in Package (SiP) components, advanced packaging solutions for electronic chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Foxconn](https://endata.com/companies/15170.md) (partner)
- [Thales](https://endata.com/companies/16630.md) (partner)
- [Radiall](https://endata.com/companies/84812.md) (partner)

## Sources

- [lifeofsoldiers.com](https://www.lifeofsoldiers.com/2026/06/02/foxconn-radiall-and-thales-inaugurate-tessalia-to-produce-more-than-50-million-made-in-europe-components-annually/), 2026-06-02: "This company, called Tessalia Technology SAS, will be dedicated to Outsourced Semiconductor Assembly and Testing (OSAT)."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.