# Shenzhen Kaifa Technology to invest $2B in memory chip packaging expansion

Shenzhen Kaifa Technology's subsidiaries, Shenzhen Payton Technology and Hefei Payton Storage Technology, plan to invest 14.7 billion yuan to expand high-end memory chip packaging and testing capacity. The project will add significant monthly capacity at both sites.

- Type: Expansion
- Announced: 2026-05-26
- Where: Shenzhen and Hefei, China
- Value: $2.00B (14.7B CNY)
- Status: announced
- Capacity: Shenzhen: 5 million grains packaging and 8 million chips testing per month; Hefei: 28.8 million grains packaging per month
- Products: high-end memory chip packaging and testing
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shenzhen Kaifa Technology](https://endata.com/companies/92121.md)
- [Shenzhen Payton Technology](https://endata.com/companies/92122.md)
- [Hefei Payton Storage Technology](https://endata.com/companies/92123.md)

## Sources

- [beta.zhitongcaijing.com](http://beta.zhitongcaijing.com/content/detail/1446165.html), 2026-05-26: "项目计划总投资14.7亿元，用于购置高端芯片测试机、高精度晶圆研磨一体机等设备、厂房装修及配套动力设施等。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.