# ASE and WUS to build advanced AI packaging hub in Kaohsiung, Taiwan

Advanced Semiconductor Engineering (ASE) and WUS Printed Circuit Co. announced a strategic collaboration to build a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung, Taiwan. The total investment is approximately NT$35 billion, and the facility is scheduled for completion by September 2029.

- Type: New facility
- Announced: 2026-05-08
- Where: Nanzih Technology Industrial Park, Kaohsiung, TWN
- Value: $1.07B (35.0B TWD)
- Jobs: 2,000
- Starts operating: Sep 2029
- Status: announced
- Products: advanced packaging, FOCoS, FC BGA
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Advanced Semiconductor Engineering](https://endata.com/companies/19708.md)
- [WUS Printed Circuit](https://endata.com/companies/67501.md) (partner)

## Sources

- [marketscreener.com](https://www.marketscreener.com/news/ase-technology-and-wus-announce-strategic-collaboration-to-build-advanced-ai-packaging-hub-in-kaoh-ce7f5bdbd98ef321), 2026-05-08: "This landmark agreement is a strategic collaboration between ASE and WUS to improve land use efficiency and allow ASE to expand our manufacturing capacities to meet market demands."
- [iconnect007.com](https://iconnect007.com/article/149942/ase-wus-announce-strategic-collaboration-to-build-advanced-ai-packaging-hub-in-kaohsiung/149939/aep), 2026-05-08: "This landmark agreement is a strategic collaboration between ASE and WUS to improve land use efficiency and allow ASE to expand our manufacturing capacities to meet market demands."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.