# SK Hynix to invest $12.85B in new advanced packaging plant in South Korea

SK Hynix plans to invest 19 trillion won ($12.85 billion) in a new manufacturing plant in South Korea for advanced packaging of AI memory chips, including HBM. Construction starts in April 2026.

- Type: New facility
- Announced: 2026-04-22
- Where: South Korea, South Korea
- Value: $12.8B
- Status: announced
- Products: advanced packaging for AI memory chips, HBM
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [SK Hynix](https://endata.com/companies/2769.md)

## Sources

- [english.aawsat.com](https://english.aawsat.com/technology/5265257-sk-hynix-invest-about-13-bln-new-south-korea-plant-meet-ai-memory-demand), 2026-04-22: "SK Hynix said on Wednesday it plans to invest 19 trillion won ($12.85 billion) in a new manufacturing plant in South Korea for advanced packaging, to meet rising global demand for AI memory, with construction starting this month."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.