# Samsung plans $4 billion chip packaging plant in Vietnam

Samsung Electronics Co. plans a $4 billion investment to build a chip packaging plant in northern Vietnam.

- Type: New facility
- Announced: 2026-04-09
- Where: northern Vietnam, Vietnam
- Value: $4.00B
- Status: announced
- Products: chip packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)

## Sources

- [bloomberg.com](https://www.bloomberg.com/news/articles/2026-04-09/samsung-to-invest-4-billion-in-chip-packaging-site-in-vietnam), 2026-04-09: "Samsung and its global peers are expanding at a rapid pace to meet rising demand for chips."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.