# ESMC joint venture to build €10B+ fab in Dresden

The European Semiconductor Manufacturing Company (ESMC) joint venture of TSMC, Bosch, Infineon, and NXP is building a new fab in Dresden costing over €10 billion, with half subsidized by the EU Chips Act.

- Type: New facility
- Announced: 2026-04-05
- Where: Dresden, Germany
- Value: $11.0B (10.0B EUR)
- Status: announced
- Products: semiconductor chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Bosch](https://endata.com/companies/1725.md) (partner)
- [Infineon Technologies AG](https://endata.com/companies/15717.md) (partner)
- [TSMC](https://endata.com/companies/15886.md) (partner)
- [NXP Semiconductors](https://endata.com/companies/19521.md) (partner)

## Sources

- [arveum.com](https://arveum.com/en/newsletter/semicon/2026-04-05-412), 2026-04-05: "the new fab is slated to cost over €10 billion, with half subsidized by the EU Chips Act."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.