# Rohm, Toshiba and Mitsubishi Electric to merge power semiconductor businesses

Rohm, Toshiba Electronic Devices & Storage Corp. and Mitsubishi Electric signed an MOU to deeply integrate their power semiconductor businesses into a new joint venture, aiming to become the world's second-largest power chip supplier.

- Type: Partnership
- Announced: 2026-03-27
- Where: Japan
- Status: announced
- Products: power semiconductors, SiC MOSFETs, power management ICs
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [ROHM Semiconductor](https://endata.com/companies/61439.md)
- [Mitsubishi Electric](https://endata.com/companies/2378.md) (partner)
- [Toshiba](https://endata.com/companies/8893.md) (partner)
- [Toshiba Electronic Devices & Storage Corporation](https://endata.com/companies/32335.md) (partner)

## Sources

- [eetimes.com](https://www.eetimes.com/rohm-joins-toshiba-and-mitsubishi-to-create-a-power-chip-titan/), 2026-03-31: "The three Japanese companies in this tie-up collectively hold 11% of the global power semiconductor market, compared to Infineon's 24%."
- [semicone.com](https://www.semicone.com/article-419.html), 2026-03-31: "Rohm, Toshiba, and Mitsubishi Electric formally signed a Memorandum of Understanding, announcing their intention to deeply integrate their respective power semiconductor businesses and jointly establish a new joint venture operating company."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.