# Ibiden approves JPY 500 billion capital investment for IC package substrate capacity

Ibiden Co., Ltd. announced a capital investment plan of approximately JPY 500 billion over fiscal years 2026-2028 to expand production capacity for high-performance IC package substrates, primarily for AI servers. The first phase includes JPY 220 billion for the Gama Plant and other sites, with mass production starting from fiscal year 2027.

- Type: Investment
- Announced: 2026-02-03
- Where: Ogaki, Gifu Prefecture, Japan
- Value: $3.30B (500.0B JPY)
- Starts operating: Q2 2027
- Status: announced
- Products: high-performance IC package substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [IBIDEN Co., Ltd.](https://endata.com/companies/23859.md)

## Sources

- [marketscreener.com](https://www.marketscreener.com/news/ibiden-co-ltd-announces-capital-investment-plan-for-expansion-of-production-capacity-ce7e5adfd989f027), 2026-02-03: "Ibiden Co.,Ltd. announced that the Board of Directors... resolved to approve a capital investment plan for its electronics business, amounting to approximately JPY 500 billion over the three-year period from fiscal year 2026 to fiscal year 2028"
- [japanir.jp](https://japanir.jp/en/company/company-4062/ir/4062-20260203-03_wp_business_update/), 2026-02-03: "Plans to invest approximately 500 billion yen from fiscal 2026 through 2028 to expand production capacity of high-performance IC package substrates."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.