# SK Hynix to build $12.9bn semiconductor packaging plant in Cheongju

SK Hynix plans to invest KRW 19 trillion ($12.9 billion) in a new semiconductor packaging facility called P&T7 in Cheongju, South Korea. Construction will start in April 2026 and is targeted for completion by the end of 2027. The plant will focus on advanced packaging for HBM chips used in AI applications.

- Type: New facility
- Announced: 2026-01-13
- Where: Cheongju, North Chungcheong Province, South Korea
- Value: $12.9B (19000.0B KRW)
- Starts operating: 2027
- Status: announced
- Products: high-bandwidth memory (HBM) chips, advanced packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [SK Hynix](https://endata.com/companies/2769.md)

## Sources

- [verdict.co.uk](https://www.verdict.co.uk/sk-hynix-12-9bn-plant/), 2026-01-13: "SK Hynix has announced plans to invest Won19tn ($12.9bn) in the construction of a semiconductor packaging facility in Cheongju, North Chungcheong Province, South Korea."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.