# Silan Microelectronics starts construction of $2.8B analog chip fab in Xiamen

Hangzhou Silan Microelectronics Co., Ltd. broke ground on the Silan Jihua 12-inch high-end analog integrated circuit chip manufacturing production line project in Xiamen's Haicang District on January 4, 2026. The total investment is 20 billion yuan, with the first phase of 10 billion yuan expected to achieve preliminary production in Q4 2027 and full production by 2030, reaching an annual capacity of 240,000 12-inch wafers.

- Type: New facility
- Announced: 2026-01-04
- Where: Haicang District, Xiamen, China
- Value: $2.77B (20.0B CNY)
- Starts operating: Q4 2027
- Status: under construction
- Capacity: 240,000 12-inch wafers per year (Phase 1); 540,000 wafers per year (total after Phase 2)
- Products: high-end analog integrated circuit chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hangzhou Silan Microelectronics](https://endata.com/companies/28899.md)

## Sources

- [seetaoe.com](https://www.seetaoe.com/details/256473.html), 2026-01-12: "This is not only a huge investment industry project, but also seen by the industry as a key step for the domestic IDM model to break through to the high-end analog chip field."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.