# Applied Materials and Besi launch Kinex hybrid bonding system

Applied Materials and BE Semiconductor Industries introduced Kinex, the industry's first integrated die-to-wafer hybrid bonding system, combining all critical process steps in a single tool for advanced logic and memory chips.

- Type: Product launch
- Announced: 2025-11-08
- Status: announced
- Products: Kinex die-to-wafer hybrid bonding system
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Applied Materials](https://endata.com/companies/26975.md)
- [BE Semiconductor Industries](https://endata.com/companies/41495.md) (partner)

## Sources

- [blog.baldengineering.com](https://www.blog.baldengineering.com/2025/11/applied-materials-deepens-partnership.html), 2025-11-08: "Applied Materials and BE Semiconductor Industries (Besi) have introduced Kinex, the industry's first integrated die-to-wafer hybrid bonding system, engineered to deliver higher performance and lower power consumption for advanced logic and memory chips."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.