# Applied Materials acquires 9% stake in Besi

Applied Materials acquired a 9% stake in BE Semiconductor Industries (Besi) to strengthen their collaboration on hybrid bonding technology for advanced semiconductor packaging.

- Type: Acquisition
- Announced: 2025-11-08
- Status: completed
- Products: hybrid bonding systems, die-to-wafer bonding equipment
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Applied Materials](https://endata.com/companies/26975.md) (acquirer)
- [BE Semiconductor Industries](https://endata.com/companies/41495.md) (target)

## Sources

- [blog.baldengineering.com](https://www.blog.baldengineering.com/2025/11/applied-materials-deepens-partnership.html), 2025-11-08: "Applied Materials announced it has acquired a 9% stake in BE Semiconductor Industries (Besi) to strengthen their ongoing collaboration on hybrid bonding technology for advanced semiconductor packaging."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.