# STMicroelectronics to develop PLP pilot line in Tours, France

STMicroelectronics announced a new pilot line for Panel-Level Packaging technology at its Tours, France site, supported by a $60 million investment. The line is expected to be operational in Q3 2026.

- Type: Investment
- Announced: 2025-09-17
- Where: Tours, France, France
- Value: $60.0M
- Starts operating: Q3 2026
- Status: announced
- Products: Panel-Level Packaging technology for chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [STMicroelectronics](https://endata.com/companies/21952.md)

## Sources

- [newsroom.st.com](https://newsroom.st.com/media-center/press-item.html/c3358.html), 2025-09-17: "The development of our PLP capabilities in our Tours site is aimed at advancing this innovative approach to chip packaging and test manufacturing technology."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.