# Amkor Technology breaks ground on $7B semiconductor packaging campus in Arizona

Amkor Technology has broken ground on a new semiconductor advanced packaging and test campus in Arizona, with an expanded investment of $7 billion. The campus will include over 750,000 square feet of cleanroom space and create up to 3,000 jobs. Construction of the first facility is expected to be completed in mid-2027, with production beginning in early 2028.

- Type: New facility
- Announced: 2025-10-06
- Where: Arizona, USA, United States
- Value: $7.00B
- Jobs: 3,000
- Starts operating: 2028
- Status: under construction
- Capacity: 750,000 square feet of cleanroom space
- Products: semiconductor advanced packaging and test services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Amkor Technology](https://endata.com/companies/21914.md)

## Sources

- [ir.amkor.com](https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced), 2025-10-06: "Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test "

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.